About this Hardcover
- ISBN-13
- 9781032160818
- Author
- Juan Cepeda-Rizo,Jeremiah Gayle,Joshua Ravich
- Publisher
- CRC Press
- Edition
- 1
- Published
- 2021-12-30
- Pages
- 290
- Binding
- Hardcover
Verified US edition — ISBN 9781032160818
ISBN 9781032160818 identifies the 1 of Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments by Juan Cepeda-Rizo by Juan Cepeda-Rizo,Jeremiah Gayle,Joshua Ravich, published by CRC Press (2021-12-30). Every copy Book Shop Now ships against this ISBN is the genuine US-edition print run from the original publisher's authorized US distribution — no overseas reprints, no scanned facsimiles, no "international edition" rebranding. Verify this ISBN against your professor's syllabus before checkout.
About CRC Press
Routledge and its sister imprints CRC Press, Focal Press, and Taylor & Francis are part of Informa plc — together producing reference works across counseling, social sciences, language studies, engineering, and academic specialties. CRC Press's medical and clinical references (50 Landmark Papers series, surgical atlases) are board-prep staples. Routledge social-sciences titles dominate graduate-level reading lists. We source Routledge family titles directly from authorized US distribution.
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