John Wiley & Sons
Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces High Performance Compute and System-in-Package
Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces High Performance Compute and System-in-Package
ISBN-13: 9781119793779
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About this Hardcover
- ISBN-13
- 9781119793779
- Author
- Beth Keser,Steffen Kr¿hnert
- Publisher
- John Wiley & Sons
- Edition
- 1
- Published
- 2021-12-29
- Pages
- 320
- Binding
- Hardcover
Verified US edition — ISBN 9781119793779
ISBN 9781119793779 identifies the 1 of Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces High Performance Compute and System-in-Package by Beth Keser,Steffen Kr¿hnert, published by John Wiley & Sons (2021-12-29). Every copy Book Shop Now ships against this ISBN is the genuine US-edition print run from the original publisher's authorized US distribution — no overseas reprints, no scanned facsimiles, no "international edition" rebranding. Verify this ISBN against your professor's syllabus before checkout.
About John Wiley & Sons
John Wiley & Sons publishes academic and professional reference books across business, sciences, engineering, and education. Wiley's medical journal back-titles, biostatistics references, and professional design textbooks (Piotrowski's Professional Practice for Interior Designers, Wiley Finance series) are widely course-assigned. Book Shop Now sources Wiley US editions directly to maintain ISBN verifiability.
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