About this Hardcover
- ISBN-13
- 9789811570896
- Author
- Yan Li,Deepak Goyal
- Publisher
- Springer Nature Singapore
- Edition
- 2
- Published
- 2020-11-24
- Pages
- 622
- Binding
- Hardcover
Verified US edition — ISBN 9789811570896
ISBN 9789811570896 identifies the 2 of 3D Microelectronic Packaging From Architectures to Applications by Yan Li,Deepak Goyal, published by Springer Nature Singapore (2020-11-24). Every copy Book Shop Now ships against this ISBN is the genuine US-edition print run from the original publisher's authorized US distribution — no overseas reprints, no scanned facsimiles, no "international edition" rebranding. Verify this ISBN against your professor's syllabus before checkout.
About Springer Nature Singapore
Springer Publishing Company (NYC) publishes nursing, counseling, social work, and health-professions reference books — including the 101/301 Careers series, Springer Series on Behavioral Addictions, and clinical advanced-practice references. Distinct from Springer Nature (scientific journals), Springer Publishing's titles dominate MSN/DNP and CACREP-accredited counseling program reading lists. We source directly from Springer's US warehouse.
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